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?吳勇波

講席教授 、 博士生導師

研究方向:
多場(超聲、磁流變、等離子體氧化、固相化學反應、電致塑性效應)輔助精密超精密加工。
E-mail:
wuyb@sustech.edu.cn
個人主頁
?吳勇波
吳勇波,1997年獲得東北大學(日本)博士學位,回國前任日本秋田縣立大學終身正教授,國際磨粒技術委員會委員、國際納米制造學會會士、 國際微納機械加工制造學術研討會ISMNM系列組委會主席。在精密加工制造領域開展了多年卓越的科研教學工作,率先在國際上提出多場輔助精密加工概念,并開展了一系列前瞻性的原創性研究。發表高水平論文200多篇,日本專利16項,中國專利8項,參與撰寫英日文著作5部,先后承擔項目40余項,獲得超3億日元的研究經費。接受與培養訪問研究員、博士生、碩士生60余人。

研究領域:

 超聲輔助機械加工工藝與設備
◆ 磁場利用研拋精密加工工藝與設備
 溫度場輔助高效加工工藝與設備
 固相化學反應利用/超聲輔助復合加工工藝與設備

學習經歷:

◆ 1978.10 - 1982.07:合肥工業大學 ,機械制造工程,學士
◆ 1982.09 - 1985.02 :北京航空航天大學,航空制造工程,碩士
◆ 1992.04 - 1997.03 :東北大學(日本),精密工學工程,博士

工作經歷:

◆ 2017.05 - 現在   南方科技大學,講座教授
 2007.04 - 2017.04  秋田縣立大學 教授,研究室主任
 2004.04 - 2007.03  秋田縣立大學,副教授
◆ 2000.04 - 2004.03  秋田縣立大學,專任講師
 1998.07 - 2000.03  東北大學(日本),研究助理教授
 1997.04 - 1998.06  尼康公司,高級工程師
◆ 1991.10 - 1992.03  東北大學(日本),客座研究員
◆ 1989.06 - 1991.09  南昌航空大學,講師
 1987.10 - 1989.05   豐橋技術科學大學,客座研究員
◆ 1985.03 - 1987.09   南昌航空大學,助教

所獲榮譽:
◆ 2018年入選深圳市南山區“領航人才”A類
◆ 2017年入選深圳市海外高層次人才“孔雀人才”A類
◆ 2012,Fellow, International Society of NanoManufacturing (ISNM)
◆ 2013,Representative, Japan Society for Precision Engineering (JSPE)
◆ 2012, Advisor/Supervisor of outstanding young scholar Award Winnerat 12theuspen,Stockholm, Sweden,
◆ 2013,Advisor/Supervisor of best paper Award Winner at 8th LEM21, Matsushima, Japan
◆ 2014,Advisor/Supervisor of outstanding young scholar Award Winner at 14theuspen, Dubrovnik, Croatia,
◆ 2015,Advisor of best paper Award winner at 11th CJUMP, Itabashi, Tokyo, Japan
◆ 2011年江西省“贛鄱英才555工程”第一批入選者
◆ 2009,30th Machine Tools Technology Award, Japanese Machine Tools Technology Promotion Foundation
◆ 2004,Best Paper Award of JSAT (Japan Society for Abrasive Technology)
◆ 2002,Kumagai Award of JSPE (Japan Society for Precision Engineering)
◆ 1999,Manufacturing and Machine Tool Research Award of JSME (Japan Society of Mechanical Engineers)

代表性學術論文:
1. Y. Wu*, Q. Wang, S. Li, D. Lu, Ultrasonic Assisted Machining of Nickle-based Superalloy Inconel 718, in: Superalloys, In Tech Publishers, ISBN 978-953-51-5335-1, Croatia-EU, 2018.3.1.
2. S. Li, Y. Wu*, M. Nomura, T. Fujii, Proposal of an ultrasonic assisted electrochemical grinding method and its fundamental machining characteristics in the grinding of Ti–6Al–4V, ASME Journal of Manufacturing Science and Engineering, 140 (2018) 071009-1-9.
3. W. Xu* and Y. Wu*, A novel approach to fabricate high aspect ratio micro-rod using ultrasonic vibration-assisted centreless grinding,International Journal of Mechanical Sciences, 141 (2018) 21-30.
4. Q. Wang, Y. Wu*, T. Bitou, M. Nomura, T. Fujii, Proposal of a tilted helical milling technique for high quality hole drilling of CFRP: Kinetic analysis of hole formation and material removal, International Journal of Advanced Manufacturing Technology, 94 (2018)4221-4235,DOI 10.1007/s00170-017-1106-3
5. S. Li, Y. Wu*, K. Yamamura, M. Nomura, T. Fujii, Improving the grindability of titanium alloy Ti-6Al-4V with the assistance of ultrasonic vibration and plasma electrolytic oxidation, CIRP Annals Manufacturing Technology, Vol.66, Issue 1 (2017) DOI: 10.1016/j.cirp.2017.04.089
6. Y. Wu*, S. Li, M. Nomura, S. Kobayashi, T. Tachibana, Ultrasonic assisted electrolytic grinding of titanium alloy Ti-6Al-4V,International Journal of Nanomanufacturing, Vol.13, Issue 2( 2017) 152-160.
7. S. Li, Y. Wu*, M. Nomura, Effect of grinding wheel ultrasonic vibration on chip formation in surface grinding of Inconel 718, Int. J. of Advanced Manufacturing Technology, 2016; DOI: 10.1007/s00170-015-8149-0.
8. Y. Wang, Y. Wu* and M. Nomura, Feasibility study on surface finishing of miniature V-grooves with magnetic compound fluid slurry, Precision Engineering, Vol.45, (2016) pp.67-78.
9. S. Li, Y. Wu*, M. Nomura, Improving the working surface condition of electroplated cBN grinding quill in surface grinding of Inconel 718 by the assistance of ultrasonic vibration, ASME J. of Manufacturing Science and Engineering, Vol.138, (2016) pp.071008-1_8.
10. D. Lu, Q. Wang, Y. Wu*, J. Cao, H. Guo, Fundamental Turning Characteristics of Inconel 718 by Applying Ultrasonic Elliptical Vibration on the Base Plane, Materials and Manufacturing Processes, Vol.30, No.8 (2015) pp.1010-1017.
11. J. Cao, Y. Wu*, J. Li, Q. Zhang, A grinding force model for ultrasonic assisted internal grinding (UAIG) of SiC ceramics, Int. J. of Advanced Manufacturing Technology, Vol.81, No.5 (2015) pp.875-885.
12. Y. Wang, Y. Wu*, H. Guo, M. Fujimoto, M. Nomura and K. Shimada, A New MCF (Magnetic Compound Fluid) Slurry and its Performance in Magnetic Field-assisted Polishing of Oxygen- free Copper, J. of Applied Physics, 117 (2015) pp.17D712-1_4.
13. H. Guo, Y. Wu*, D. Lu, M. Fujimoto, M. Nomura, Effects of pressure and shear stress on material removal rate in ultra-fine polishing of optical glass with magnetic compound fluid slurry, J. of Materials Processing Technology, Vol.214, No.11 (2014) pp.2759-2769.
14. J. Cao, Y. Wu*, D. Lu, M. Fujimoto, M. Nomura, Material removal behavior in ultrasonic- assisted scratching of SiC ceramics with a single diamond tool, Int. J. of Machine Tools and Manufacture, Vol. 79 (2014) pp.49-61.
15. Y. Li, Y. Wu*, L. Zhou, M. Fujimoto, Vibration-Assisted Dry Polishing of Fused Silica Using a Fixed-Abrasive Polisher, Int. J. of Machine Tools and Manufacture, Vol. 77, No.1 (2014) pp.93- 102.
16. L. Jiao, Y. Wu*, X. Wang, H. Guo, Z. Liang, Fundamental performance of magnetic compound fluid (MCF) wheel in ultra-fine surface finishing of optical glass, Int. J. of Machine Tools and Manufacture, Vol. 75 (2013) pp.109-118.
17. Z. Liang, X. Wang, Y. Wu, L. Xie, L. Jiao, W. Zhao, Experimental Study on Brittle - Ductile Transition in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire using Single Diamond Abrasive Grain, Int. J. of Machine Tools and Manufacture, Vol. 71, (2013) pp.41-51.
18. Y. Wu* and H. Guo, “Polishing Mechanism and Applications of Magnetic Compound Fluid (MCF) Slurry”, in: Manufacturing Technologies for the Performance Enhancement of Optical Glasses, Chapter 4.5, Science and Technology Publications, Tokyo, Japan, 2012.
19. W. Xu, Y. Wu*, Simulation investigation of through-feed centerless grinding process performed on a surface grinder, Journal of Materials Processing Technology, Vol. 212 (2012), pp.927-935.
20. Y. Li, Y. Wu*, J. Wang, W. Yang, Y. Guo and Q. Xu, Tentative investigation towards precision polishing of optical components with ultrasonically vibrating bound-abrasive pellets, Optics Express, Vol.20, No.1 (2012), pp.568-575.
21. Y. Wu*, Y. Li, J. Cao and Z. Liang, “Ultrasonic Assisted Fixed Abrasive Machining of Hard- Brittle Materials”, in: Ultrasonics: Theory, Techniques and Practical Application, NOVA SCIENCE PUBLISHERS, INC., NY, USA, 2012.
22. Y. Peng, Y. Wu*, Z.Q. Liang, Y. B. Guo and X. Lin, An Experimental Study of Ultrasonic Vibration-assisted Grinding of Polysilicon Using Two-Dimensional Vertical Workpiece Vibration, Int. J. of Advanced Manufacturing Technology, Vol.54, (2011) pp.941-947.
23. W. Xu and Y. Wu*, A new in-feed centerless grinding technique using a surface grinder J. of materials Processing Technology, Vol.211, (2011) pp.141-149.
24. Z. Liang, Y. Wu*, X. Wang, W. Zhao, T. Sato, W. Lin, A New Two-dimensional Ultrasonic Assisted Grinding (2D-UAG) Method and Its Fundamental Performance in Monocrystal Silicon Machining, Int. J. of Machine Tools and Manufacture, Vol.50, (2010) pp.728-736.
25. W. Xu, Y. Wu*, T. Sato, W. Lin, Effects of process parameters on workpiece roundness in tangential-feed centerless grinding using a surface grinder, J. of Materials Processing Technology, Vol.210, (2010) pp.759-766.
26. Y. Wu*, S. Yokoyama, T. Sato, W. Lin, T. Tachibana, Development of a new rotary ultrasonic spindle for precision ultrasonically assisted grinding, Int. J. of Machine Tools and Manufacture, Vol.49, No.12/13, (2009) pp.933-938.
27. T. Furuya, Y. Wu*, M. Nomura, Y. Shimada and K. Yamamoto, Fundamental performance of magnetic compound fluid polishing liquid in contact-free polishing of metal surface, J. of Materials Processing Technology, Vol. 201, (2008) pp.536-541.
28. Y. Wu*, “Ultrasonic-shoe Centerless Grinding”, in: Illustration of Abrasive Technology, Chapter 2.2.4, edited by Japan Society for Abrasive Technology, Nihon Kogyo Chosakai Publications, Tokyo, Japan, 2005.
29. Y. Wu*, “Ultra-precision Centerless Grinding”, in: Ultra-precision Machining and Aspherical Machining, Chapter 1.7, edited by Katsuo Syoji, NTS Publications, Tokyo, Japan, 2004.